Sonic sensors and packages

ABSTRACT

Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.

TECHNICAL FIELD

The invention relates generally to sonic sensors and more particularlyto packages for sonic, such as ultrasonic, sensors that integrate atransmitter, receiver and driver.

BACKGROUND

Ultrasonic sensors can be used for distance measurement and objectdetection. One such application is the incorporation of ultrasonicsensors in the bumpers and fenders of cars for parking assistance,obstruction detection and adaptive cruise control.

Conventional ultrasonic sensors comprise an ultrasonic transmitter, anultrasonic receiver and driver electronics soldered onto printed circuitboards (PCBs) and combined in modules. Other conventional sensors have asingle transceiver unit that toggles between transmitting and receiving.These solutions suffer from several drawbacks, including the need tosolder the components onto PCBs and increased space requirements for thecombined module, among others.

Therefore, there is a need for improved ultrasonic sensors.

SUMMARY

Embodiments relate to integrated sonic sensors having a transmitter, areceiver and driver electronics integrated in a single, functionalpackage.

In an embodiment, a sensor system comprises a silicon microphone; acontroller integrated circuit coupled to the microphone; a transmittercoupled to the controller integrated circuit and comprising apiezoelectric element; and a housing comprising a cover portion havingan aperture, wherein the microphone, the controller integrated circuitand the transmitter are provided within the housing.

In an embodiment, a method comprises providing an integrated sensorincluding a transmitter, a microelectromechanical (MEMS) microphone anddriver electronics integrated in a housing having a cover comprising apiezoelectric element; transmitting a signal by the transmitter and thepiezoelectric element; receiving a reflected signal by the receiverthrough an aperture in the cover; and determining a time of flight ofthe signal.

In an embodiment, a semiconductor chip package comprises a housing forat least one semiconductor chip, wherein at least a portion of thehousing is configured as a sound generating element to generate soundwaves based on electrical signals provided by an integrated circuit ofthe at least one semiconductor chip.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention may be more completely understood in consideration of thefollowing detailed description of various embodiments of the inventionin connection with the accompanying drawings, in which:

FIG. 1 is a diagram of a sensor system according to an embodiment.

FIG. 2 is a diagram of a cover of a package of a sensor system accordingto an embodiment.

FIG. 3 is a diagram of a sensor system according to an embodiment.

While the invention is amenable to various modifications and alternativeforms, specifics thereof have been shown by way of example in thedrawings and will be described in detail. It should be understood,however, that the intention is not to limit the invention to theparticular embodiments described. On the contrary, the intention is tocover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the appended claims.

DETAILED DESCRIPTION

Embodiments relate to integrated ultrasonic sensors having atransmitter, a receiver and driver electronics integrated in a single,functional package. In one embodiment, a piezoelectric signaltransmitter, a silicon microphone receiver and a controller/amplifierchip are concomitantly integrated in a semiconductor housing. Inembodiments, the transmitter, receiver and controller can be integratedas three separate devices, or one or more of the devices can beintegrated in a single chip. The semiconductor housing, in embodiments,is functional in that at least a portion of the housing can comprise thepiezoelectric element of the transmitter, with an inlet apertureopposite the silicon microphone receiver. Referring to FIGS. 1 and 2, anintegrated ultrasonic sensor system 100 is depicted.

Sensor system 100 comprises a housing 102, a controller/amplifier chip104, a piezoelectric signal transmitter 106 and a silicon microphonereceiver 108 such as a microelectromechanical system (MEMS) microphone.In other embodiments, sensor system 100 can comprise a supersonic sensorsystem, a sonar sensor system, a radar sensor system or some othersuitable sensor system. In embodiments, transmitter 106, receiver 108and controller 104 can be integrated as separate devices, or in otherembodiments one or more of the devices can be integrated in a singlechip. For example, in one embodiment, transmitter 106 and controller 104can be integrated in a single chip, and then integrated in housing 102with receiver 108.

In an embodiment, piezoelectric signal transmitter 106 comprises a coverportion 110 of housing 102. Cover portion 110 comprises an inletaperture 112 arranged relative to silicon microphone receiver 108 andcontacts 114, such as pins, pads or wires. The size, shape,configuration and/or placement of aperture 112 can vary in embodiments.For example, aperture 112 can be oblong or located in another positionon cover portion 110, though in general aperture 112 is arrangedrelative to receiver 108 such that reflected signals can pass throughaperture 112 to receiver 108. In embodiments, cover portion 110 cancomprise a piezoelectric plastic foil, such as polyvinylidenfluorid(PVDF); ceramic, such as lead zirconate titanate (PZT); crystal; thinfilm; silicon; metal or some other suitable membrane material. Totransfer the electric signal from chip 104 to cover portion 110, acontact can be provided between cover portion 110 and chip 104. Thecontact can be flexible, for example to address changes in the verticaldistance between cover portion 110 and chip 104. The contact cancomprise a zebra-flex, needle, spring, solder, wire or other suitablecontact. In one embodiment, cover portion 110 comprises a metal andceramic piezoelectric loudspeaker coupled to the remainder of housing102, wherein a remainder of housing can comprise, for example, a dualsmall outline flat (DSOF) package.

Cover portion 110, in cooperation with the other components oftransmitter 108, emits ultrasonic or other sound signals. The emittedsignals, such as signal pulses, can be reflected to system 100 byobjects, passing through aperture 112 to be received by receiver 108.Receiver 108 and/or controller/amplifier chip 104, which can comprise anapplication-specific integrated circuit (ASIC) in an embodiment, cancalculate a time of flight of the signal for distance determinationrelative to sensor system 100.

The integration of transmitter 106 as the sonic generation elementdirectly into cover portion 110 of a semiconductor chip package allowssynergetic combination of the covering or protection function providedby cover portion 110 for the one or more semiconductor chips with thefunctionality of generating the sonic sound for operation of sensorsystem 100. In other words, the package not only provides theconventional coverage or protection but is further functionalized toprovide additional functionality by being capable of producing sonicwaves. This provides a miniaturized system by providing an integratedsolution in which the package has the additional sonic generationfunction while also reducing manufacturing costs because no separatemanufacturing steps are necessary and the housing together with thesonic generating element can be manufactured integrally. Cover portion100 can for example include a multi-layer structure where one or more ofthe layers are sonic generating layers, for example piezoelectriclayers, in embodiments.

Another embodiment of a sensor system 200 is depicted in FIG. 3. Sensorsystem 200 comprises a housing 202, a controller/amplifier 204 such asan ASIC, a transmitter 206, a receiver 208, a cover portion 210 havingan aperture 212, and contacts 214. In sensor system 200, housing 202comprises two portions: a transmitter portion 216 and a receiver portion218. Cover portion 210 also comprises two portions: a transmittermembrane portion 220 and a receiver portion 222. Transmitter membraneportion 220 and receiver portion 222 can comprise any of the materialsand/or configurations discussed with respect to FIGS. 1 and 2. In oneembodiment as depicted in FIG. 3, receiver portion 222 can comprise ametal lid that provides electrical shielding.

Embodiments thus are related to miniaturized integrated sensor systemscomprising microphones, ASICs and transmitters in a package, with aportion of the package being functional as part of the transmitter.Embodiments have applicability to vehicular and consumer applications,such as gaming, smart phone, tablet computer and other applications ofdistance/object detection. For example, the system can be implemented ina vehicle such as an automobile, a bicycle, an electric bicycle, ascooter, a SEGWAY, construction equipment and a boat, among others. Thesystem can also be implemented in mobile/smart phone and handheld orconsole gaming systems, for example.

Various embodiments of systems, devices and methods have been describedherein. These embodiments are given only by way of example and are notintended to limit the scope of the invention. It should be appreciated,moreover, that the various features of the embodiments that have beendescribed may be combined in various ways to produce numerous additionalembodiments. Moreover, while various materials, dimensions, shapes,configurations and locations, etc. have been described for use withdisclosed embodiments, others besides those disclosed may be utilizedwithout exceeding the scope of the invention.

Persons of ordinary skill in the relevant arts will recognize that theinvention may comprise fewer features than illustrated in any individualembodiment described above. The embodiments described herein are notmeant to be an exhaustive presentation of the ways in which the variousfeatures of the invention may be combined. Accordingly, the embodimentsare not mutually exclusive combinations of features; rather, theinvention may comprise a combination of different individual featuresselected from different individual embodiments, as understood by personsof ordinary skill in the art.

Any incorporation by reference of documents above is limited such thatno subject matter is incorporated that is contrary to the explicitdisclosure herein. Any incorporation by reference of documents above isfurther limited such that no claims included in the documents areincorporated by reference herein. Any incorporation by reference ofdocuments above is yet further limited such that any definitionsprovided in the documents are not incorporated by reference hereinunless expressly included herein.

For purposes of interpreting the claims for the present invention, it isexpressly intended that the provisions of Section 112, sixth paragraphof 35 U.S.C. are not to be invoked unless the specific terms “means for”or “step for” are recited in a claim.

What is claimed is:
 1. A sensor system comprising: a silicon microphone; a controller integrated circuit coupled to the microphone; a transmitter coupled to the controller integrated circuit and comprising a piezoelectric element; and a housing comprising a cover portion having an aperture, wherein the microphone, the controller integrated circuit and the transmitter are provided within the housing.
 2. The sensor system of claim 1, wherein the microphone is arranged opposite the aperture.
 3. The sensor system of claim 1, wherein the cover portion comprises the piezoelectric element.
 4. The sensor system of claim 3, wherein the housing comprises a transmitter portion for the transmitter and a receiver portion for the receiver, the cover portion comprises a transmitter cover portion and a receiver cover portion, the transmitter cover portion comprises the piezoelectric element, and the aperture is formed in the receiver cover portion.
 5. The sensor system of claim 4, wherein the receiver cover portion comprises metal.
 6. The sensor system of claim 1, wherein the piezoelectric element comprises at least one of metal, ceramic, plastic or foil.
 7. The sensor system of claim 6, wherein the piezoelectric element comprises a polyvinylidenfluorid (PVDF) foil.
 8. The sensor system of claim 6, wherein the piezoelectric element comprises lead zirconate titanate (PZT) and metal.
 9. The sensor system of claim 1, wherein the cover portion comprises a metal shielding portion.
 10. The sensor system of claim 1, wherein the silicon microphone comprises a microelectromechanical system (MEMS) microphone.
 11. The sensor system of claim 1, wherein the controller integrated circuit comprises an amplifier.
 12. The sensor system of claim 1, wherein the transmitter comprises an ultrasonic transmitter.
 13. The sensor system of claim 1, wherein the transmitter comprises one of a supersonic, a sonar or a radar transmitter.
 14. A method comprising: providing an integrated sensor including a transmitter, a microelectromechanical (MEMS) microphone and driver electronics integrated in a housing having a cover comprising a piezoelectric element; transmitting a signal by the transmitter and the piezoelectric element; receiving a reflected signal by the receiver through an aperture in the cover; and determining a time of flight of the signal.
 15. The method of claim 14, further comprising determining a distance, from the sensor, of an object reflecting the signal from the time of flight of the signal.
 16. The method of claim 14, wherein transmitting a signal comprises transmitting one of an ultrasonic signal, a supersonic signal, a sonar signal or a radar signal.
 17. The method of claim 14, further comprising forming the housing with a transmitter portion having a transmitter portion cover comprising the piezoelectric element and a receiver portion having a receiver portion cover.
 18. The method of claim 17, wherein forming the housing further comprises forming the piezoelectric element from at least one of metal, ceramic, plastic or foil.
 19. The method of claim 17, wherein forming the housing further comprises forming the receiver portion cover from metal.
 20. The method of claim 14, further comprising mounting the sensor in a vehicle.
 21. The method of claim 20, wherein the vehicle is selected from the group consisting of an automobile, a bicycle, an electric bicycle, a scooter, a SEGWAY, construction equipment and a boat.
 22. The method of claim 14, further comprising mounting the sensor in one of a mobile phone or a gaming system.
 23. The method of claim 22, wherein the gaming system is one of a handheld gaming system or a console gaming system.
 24. A semiconductor chip package comprising: a housing for at least one semiconductor chip, wherein at least a portion of the housing is configured as a sound generating element to generate sound waves based on electrical signals provided by an integrated circuit of the at least one semiconductor chip.
 25. The semiconductor chip package of claim 24, wherein the housing further includes a sound inlet portion configured to transmit sound from external to the semiconductor package to a semiconductor microphone provided within the semiconductor chip package.
 26. The semiconductor chip package of claim 24, wherein at least a portion of the housing is configured to function as a membrane.
 27. The semiconductor chip package of claim 24, wherein the sound generating element is a piezoelectric layer. 